Semiconductor package and manufacturing method thereof

Abstract

The present disclosure provides a semiconductor package. The semiconductor package includes a base substrate, an intermediate substrate, a plurality of first conductive bumps, a first die, and a plurality of second conductive bumps. The intermediate substrate is disposed on the base substrate. The first conductive bumps are disposed between and electrically connected to the base substrate and the intermediate substrate. The first die is disposed on the intermediate substrate. The second conductive bumps are disposed between and electrically connected to the intermediate substrate and the first die. The second conductive bumps are electrically connected to the first conductive bumps through the intermediate substrate. The present disclosure further provides a method of manufacturing the above semiconductor package.

Dependencies are inferred from the claim text.