Package structures, fabricating methods thereof, and memory systems

A memory system, comprising a package structure comprising:

• a packaging substrate having a first surface and a second surface opposite the first surface;
• a semiconductor device on the first surface of the packaging substrate and coupled with the packaging substrate;
• and
• a cap layer covering the first surface and encapsulating the semiconductor device, wherein the cap layer and the packaging substrate have a total thickness in a first direction perpendicular to the first surface, a ratio between a distance from an upper surface of the cap layer to an upper surface of the semiconductor device in the first direction and the total thickness satisfies a first preset value, a pressure strain of the package structure satisfies a second preset value, and
• wherein the semiconductor device comprises a memory controller and a memory device coupled thereto, the memory controller being configured to control the memory device.

A method of fabricating a package structure, comprising:

• providing a packaging substrate having a first surface and a second surface opposite the first surface;
• disposing a semiconductor device on the first surface of the packaging substrate, the semiconductor device being coupled with the packaging substrate;
• and
• forming a cap layer covering the first surface and encapsulating the semiconductor device, wherein the cap layer and the packaging substrate have a total thickness in a first direction perpendicular to the first surface, a ratio between a distance from an upper surface of the cap layer to an upper surface of the semiconductor device in the first direction and the total thickness satisfies a first preset value, and a pressure strain of the package structure satisfies a second preset value.