Semiconductor package including package cap

A semiconductor package, comprising:

• a package substrate having a mount region and a peripheral region that surrounds the mount region;
• a semiconductor device on the mount region of the package substrate;
• a package cap on the peripheral region of the package substrate, the package cap including a partition portion that surrounds the semiconductor device and an extension portion that covers the semiconductor device;
• and
• an adhesive layer between the package substrate and a bottom surface of the package cap,
• wherein the bottom surface of the package cap has a trench,
• wherein the trench has a trapezoidal cross-section whose width decreases in a direction receding from the bottom surface of the package cap,
• wherein the trench has a first surface that is farthest away from the bottom surface of the package cap,
• wherein a width of the first surface of the trench is smaller than a width of the trench at the bottom surface of the package cap,
• wherein the adhesive layer is in contact with a top surface of the package substrate and the bottom surface of the package cap,
• wherein the adhesive layer fills the trench,
• wherein the package cap has at least a first protrusion protruding toward the package substrate from a bottom surface of the trench, and
• wherein a width of the first protrusion decreases in a direction receding from the bottom surface of the trench.

A semiconductor package, comprising:

• a package substrate;
• a semiconductor device on the package substrate;
• and
• a package cap disposed on the package substrate and surrounding the semiconductor device,
• wherein the package cap is attached to the package substrate through an adhesive layer which is on a bottom surface of the package cap,
• wherein a trench is formed on the bottom surface of the package cap, the trench having a trapezoidal cross-section whose width decreases in a direction receding from the bottom surface of the package cap,
• wherein a plurality of protrusions are on a bottom surface of the trench and protrude toward the package substrate from the bottom surface of the trench,
• wherein the trench is disposed between an inner lateral surface and an outer lateral surface of the package cap, the inner lateral surface facing the semiconductor device, and the outer lateral surface being opposite the inner lateral surface, and
• wherein a protruding height of each of the plurality of protrusions is less than a depth of the trench.