Back to results
US 2026/0282397 A1Published application
Memory package and memory module including the memory package
AssigneeSK hynix Inc.
InventorsWon Ha CHOI, Han Suk KO, Uksong KANG
Life of this patent
Estimating the term…
Abstract
A single memory package includes: a substrate; and a memory chip and a buffer chip that are integrated over the substrate, wherein the memory chip includes an interface modulator embedded therein, and the interface modulator is a serializing modulator including a multi-level amplitude modulator.
Claims20
A single package, comprising:
- a memory chip;
- a buffer chip;
- and
- an interface modulator coupled between the memory chip and the buffer chip,
- wherein the interface modulator includes:
- interface data channel buses configured to communicate with the memory chip;
- and
- buffer data channel buses configured to communicate with the buffer chip,
- wherein the memory chip, the interface modulator, and the buffer chip are integrated together over a substrate, and
- wherein the interface modulator is configured to perform a multi-level signaling operation.
7 more elements
A single package, comprising:
- a substrate;
- a memory region including a cell region;
- a buffer region including a latch circuit;
- an interface region coupled between the memory region and the buffer region;
- interface data channel buses extending between the memory region and the interface region and configured to provide communication between the memory region and the interface region;
- and
- buffer data channel buses extending between the buffer region and the interface region and configured to provide communication between the buffer region and the interface region,
- wherein the interface region is configured to perform a multi-level signaling operation, and
- wherein the memory region, the buffer region, and the interface region are integrated together over the substrate.
6 more elements
A memory module, comprising:
- a module substrate;
- a driving chip mounted over the module substrate;
- and
- a plurality of single packages mounted over the module substrate,
- wherein each of the single packages includes:
- a substrate;
- and
- a memory chip, an interface modulator, and a buffer chip provided over the substrate,
- wherein the interface modulator is configured to perform a multi-level signaling operation, and
- wherein the interface modulator includes:
- interface data channel buses configured to communicate with the memory chip;
- and
- buffer data channel buses configured to communicate with the buffer chip.
10 more elements
Dependencies are inferred from the claim text.