H10W 72/01
Manufacture or treatment
Official title: {Manufacture or treatment}
H10W72/01 (Manufacture or treatment) appears on 37,402 US grants and 43,247 published applications in this corpus.
Search patents in H10W- Granted patents
- 37,402
- Published applications
- 43,247
- Assignees
- 3,635
- Inventors
- 39,608
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 19 | 0 |
| 1978 | 14 | 0 |
| 1979 | 8 | 0 |
| 1980 | 16 | 0 |
| 1981 | 11 | 0 |
| 1982 | 13 | 0 |
| 1983 | 11 | 0 |
| 1984 | 23 | 0 |
| 1985 | 24 | 0 |
| 1986 | 17 | 0 |
| 1987 | 34 | 0 |
| 1988 | 42 | 0 |
| 1989 | 49 | 0 |
| 1990 | 74 | 0 |
| 1991 | 81 | 0 |
| 1992 | 94 | 0 |
| 1993 | 89 | 0 |
| 1994 | 119 | 0 |
| 1995 | 111 | 0 |
| 1996 | 137 | 0 |
| 1997 | 166 | 0 |
| 1998 | 259 | 0 |
| 1999 | 359 | 0 |
| 2000 | 420 | 0 |
| 2001 | 608 | 366 |
| 2002 | 737 | 922 |
| 2003 | 801 | 936 |
| 2004 | 830 | 1115 |
| 2005 | 812 | 1329 |
| 2006 | 771 | 1260 |
| 2007 | 802 | 1484 |
| 2008 | 773 | 1616 |
| 2009 | 869 | 1614 |
| 2010 | 1263 | 1564 |
| 2011 | 1366 | 1696 |
| 2012 | 1393 | 1731 |
| 2013 | 1581 | 1788 |
| 2014 | 1718 | 1988 |
| 2015 | 1835 | 2278 |
| 2016 | 2011 | 1994 |
| 2017 | 2040 | 2048 |
| 2018 | 1842 | 1930 |
| 2019 | 1920 | 2139 |
| 2020 | 1963 | 2402 |
| 2021 | 1835 | 2338 |
| 2022 | 1785 | 2251 |
| 2023 | 1741 | 1895 |
| 2024 | 1672 | 1832 |
| 2025 | 1448 | 1694 |
| 2026 | 783 | 1037 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 72/0198Batch processes18,119
- H10W 72/012Of bump connectors, dummy bumps or thermal bumps12,086
- H10W 72/019Of bond pads9,308
- H10W 72/013Of die-attach connectors4,432
- H10W 72/015Of bond wires3,182
- H10W 72/011Apparatus therefor1,033
- H10W 72/016Of strap connectors547
- H10W 72/014Of anisotropic conductive adhesives0
Recent patents
- Electronic device and manufacturing method of electronic device6 Oct 2026US 12,757,487 B2Innolux Corporation
- Semiconductor structure and alignment method thereof6 Oct 2026US 12,757,744 B2United Microelectronics Corp.
- Metal pillar for conductive connection6 Oct 2026US 12,757,750 B2Duksan Hi-Metal Co., Ltd.
- Semiconductor device and method of fabricating the same6 Oct 2026US 12,757,777 B2Samsung Electronics Co., Ltd.
- Semiconductor package including preformed support structure6 Oct 2026US 12,757,779 B2Samsung Electronics Co., Ltd.
- Interconnect structure and method of forming same8 Oct 2026US 2026/0306859 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor devices configured for repairing defective bumps8 Oct 2026US 2026/0309777 A1SK hynix Inc.
- Wiring substrate8 Oct 2026US 2026/0309912 A1Ibiden Co., Ltd.
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and method for fabricating the same8 Oct 2026US 2026/0314354 A1National Yang Ming.Chiao Tung University
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015