H10W 72/015
Of bond wires
Official title: {of bond wires}
H10W72/015 (Of bond wires) appears on 3,182 US grants and 3,395 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,182
- Published applications
- 3,395
- Assignees
- 847
- Inventors
- 5,945
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 1 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 5 | 0 |
| 1983 | 4 | 0 |
| 1984 | 9 | 0 |
| 1985 | 10 | 0 |
| 1986 | 6 | 0 |
| 1987 | 11 | 0 |
| 1988 | 11 | 0 |
| 1989 | 15 | 0 |
| 1990 | 16 | 0 |
| 1991 | 25 | 0 |
| 1992 | 22 | 0 |
| 1993 | 16 | 0 |
| 1994 | 18 | 0 |
| 1995 | 26 | 0 |
| 1996 | 22 | 0 |
| 1997 | 35 | 0 |
| 1998 | 38 | 0 |
| 1999 | 65 | 0 |
| 2000 | 60 | 0 |
| 2001 | 91 | 55 |
| 2002 | 79 | 110 |
| 2003 | 83 | 102 |
| 2004 | 81 | 128 |
| 2005 | 89 | 151 |
| 2006 | 75 | 145 |
| 2007 | 76 | 170 |
| 2008 | 73 | 190 |
| 2009 | 100 | 168 |
| 2010 | 123 | 179 |
| 2011 | 129 | 162 |
| 2012 | 154 | 171 |
| 2013 | 149 | 160 |
| 2014 | 162 | 179 |
| 2015 | 165 | 193 |
| 2016 | 179 | 168 |
| 2017 | 141 | 154 |
| 2018 | 133 | 118 |
| 2019 | 111 | 94 |
| 2020 | 101 | 129 |
| 2021 | 87 | 104 |
| 2022 | 96 | 128 |
| 2023 | 81 | 89 |
| 2024 | 97 | 67 |
| 2025 | 64 | 44 |
| 2026 | 34 | 37 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bonding wire for semiconductor devices8 Sep 2026US 12,733,530 B2Nippon Micrometal Corporation
- Offset interposers for large-bottom packages and large-die package-on-package structures8 Sep 2026US 12,733,556 B2Intel Corporation
- Imaging element package, method of manufacturing the same, and electronic device25 Aug 2026US 12,720,878 B2Sony Semiconductor Solutions Corporation
- Bonding wire for semiconductor devices25 Aug 2026US 12,721,208 B2Nippon Micrometal Corporation
- Semiconductor package including surface with reduced visual variation18 Aug 2026US 12,713,974 B2Samsung Electronics Co., Ltd.
- Stacked semiconductor die assemblies with die support members and associated systems and methods1 Oct 2026US 2026/0305487 A1Micron Technology, Inc.
- High bandwidth 3d mesh interconnect structure1 Oct 2026US 2026/0305499 A1Atum Works Inc.
- Wirebonding systems and related methods17 Sep 2026US 2026/0282990 A1Semiconductor Components Industries, LLC
- Elevated interposer for wire bonding in stacked semiconductor devices, and associated systems and methods17 Sep 2026US 2026/0283045 A1Micron Technology, Inc.
- Automatic wire threading method and system27 Aug 2026US 2026/0250097 A1Asmpt Singapore Pte. Ltd.
Most cited
By later US patents
- Multiple encapsulation of phosphor-LED devices773US 5,959,316 AHewlett-Packard Company · 1999
- Wavelength-converting casting composition and its use749US 6,066,861 ASiemens Aktiengesellschaft · 2000
- Light emitting diode and method for fabricating the same489US 8,399,944 B2Samsung Electronics Co., Ltd. · 2013
- Light emitting diode and method for fabricating the same482US 8,536,604 B2Samsung Electronics Co., Ltd. · 2013
- Led lamp477US 6,577,073 B2Matsushita Electric Industrial Co., Ltd. · 2003