H10W 72/01561
Chemical or physical modification
Official title: {Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W72/01551)}
H10W72/01561 (Chemical or physical modification) appears on 28 US grants and 38 published applications in this corpus.
Search patents in H10W- Granted patents
- 28
- Published applications
- 38
- Assignees
- 29
- Inventors
- 71
- Latest grant
- 16 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 0 | 4 |
| 2011 | 1 | 0 |
| 2012 | 2 | 4 |
| 2013 | 4 | 5 |
| 2014 | 0 | 1 |
| 2015 | 3 | 3 |
| 2016 | 5 | 2 |
| 2017 | 3 | 5 |
| 2018 | 2 | 1 |
| 2019 | 1 | 1 |
| 2020 | 2 | 0 |
| 2021 | 1 | 2 |
| 2022 | 0 | 2 |
| 2023 | 1 | 2 |
| 2024 | 1 | 1 |
| 2025 | 1 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package and method of fabricating the same16 Sep 2025US 12,418,004 B2Samsung Electronics Co., Ltd.
- Semiconductor device and method of manufacturing the same13 Feb 2024US 11,901,337 B2Kioxia Corporation
- Package comprising wire bonds configured as a heat spreader3 Jan 2023US 11,545,411 B2QUALCOMM Incorporated
- Method for processing an ultra-high density space interconnect lead under light source guidance28 Dec 2021US 11,211,357 B2Guangdong University of Technology
- Bonding wire for semiconductor device17 Nov 2020US 10,840,208 B2Nippon Micrometal Corporation
- Wire post bump forming process23 Jul 2026US 2026/0215313 A1Texas Instruments Incorporated
- Semiconductor device and method of manufacturing the same19 Jun 2025US 2025/0201673 A1Renesas Electronics Corporation
- Semiconductor packaging with embedded emf shielding protection using wire bonding19 Dec 2024US 2024/0421055 A1STMicroelectronics International N. V.
- Bonding Wire and Method for Manufacturing the Same27 Apr 2023US 2023/0125151 A1Nippon Telegraph and Telephone Corporation
- Semiconductor package and method of fabricating the same2 Mar 2023US 2023/0060586 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Apparatus, system, and method for wireless connection in integrated circuit packages111US 8,084,867 B2Intel Corporation · 2011
- Semiconductor package with embedded die62US 8,174,119 B2STATS ChipPAC, Ltd. · 2012
- Semiconductor device and method of forming stud bumps over embedded die9US 8,525,337 B2STATS ChipPAC, Ltd. · 2013
- Semiconductor package with embedded die9US 9,385,074 B2STATS ChipPAC Pte. Ltd. · 2016
- Ball bonding of aluminum bonding wire8US 4,860,941 AAlcan International Limited · 1989