Semiconductor device and method of forming stud bumps over embedded die
AssigneeSTATS ChipPAC, Ltd.
InventorRajendra D. Pendse
Life of this patent
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Abstract
A semiconductor package having an embedded die and solid vertical interconnections, such as stud bump interconnections, for increased integration in the direction of the z-axis (i.e., in a direction normal to the circuit side of the die). The semiconductor package can include a die mounted in a face-up configuration (similar to a wire bond package) or in a face-down or flip chip configuration.
Claims32
A method of making a semiconductor device, comprising:
- providing a substrate;
- forming a first conductive layer over a first surface of the substrate;
- disposing a semiconductor die over the first surface of the substrate;
- forming a plurality of first stud bumps over the first conductive layer and including a base portion extending to a sidewall of the first conductive layer and a stem portion extending from the base portion, wherein a width of the base portion is greater than a width of the first conductive layer;
- forming a plurality of second stud bumps over the semiconductor die, the second stud bumps including a base portion and a stem portion extending from the base portion;
- and
- depositing an encapsulant over the substrate, semiconductor die, first stud bumps, and second stud bumps.
A method of making a semiconductor device, comprising:
- providing a semiconductor die;
- forming a first conductive layer in a peripheral region around the semiconductor die;
- forming a first stud bump over the first conductive layer, the first stud bump including a base portion extending to a sidewall of the first conductive layer and a stem portion extending from the base portion;
- and
- depositing an encapsulant over the semiconductor die and first stud bump.
A method of making a semiconductor device, comprising:
- providing a semiconductor die;
- forming a first stud bump over the semiconductor die by,
- (a) providing a bond wire,
- (b) rounding an end of the bond wire to form a base portion of the first stud bump, and
- (c) trimming the bond wire to form a stem portion of the first stud bump;
- and
- depositing an encapsulant over the semiconductor die and first stud bump.
A method of making a semiconductor device, comprising:
- providing a semiconductor die including a conductive layer in a peripheral region around the semiconductor die;
- forming a first stud bump over the conductive layer by,
- (a) providing a bond wire,
- (b) rounding an end of the bond wire to form a base portion of the first stud bump extending to a sidewall of the conductive layer, and
- (c) trimming the bond wire to form a stem portion of the first stud bump;
- and
- depositing an encapsulant over the semiconductor die and first stud bump.
A method of making a semiconductor device, comprising:
- providing a semiconductor die;
- forming a first conductive layer in a peripheral region around the semiconductor die;
- and
- forming a first stud bump over the first conductive layer, the first stud bump including a base portion and a stem portion extending from the base portion, wherein a width of the base portion is greater than a width of the first conductive layer.
Dependencies are inferred from the claim text.