H10W 72/01504
Using temporary auxiliary members
Official title: {using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}
H10W72/01504 (Using temporary auxiliary members) appears on 6 US grants and 9 published applications in this corpus.
Search patents in H10W- Granted patents
- 6
- Published applications
- 9
- Assignees
- 8
- Inventors
- 24
- Latest grant
- 28 Sep 2021
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2017 | 1 | 2 |
| 2018 | 1 | 3 |
| 2019 | 1 | 1 |
| 2020 | 2 | 0 |
| 2021 | 1 | 1 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package including stacked semiconductor chips and method for fabricating the same28 Sep 2021US 11,133,287 B2SK hynix Inc.
- Bonding method24 Mar 2020US 10,600,754 B2Kaijo Corporation
- Connection pads for low cross-talk vertical wirebonds3 Mar 2020US 10,580,756 B2Intel Corporation
- Electronic device by laser-induced forming and transfer of shaped metallic interconnects21 May 2019US 10,297,565 B2The United States of America as represented by the Secretary of the Navy
- Laser-induced forming and transfer of shaped metallic interconnects8 May 2018US 9,966,356 B2The United States of America as represented by the Secretary of the Navy
- Wire post bump forming process23 Jul 2026US 2026/0215313 A1Texas Instruments Incorporated
- Passivation coating on copper metal surface for copper wire bonding application26 Feb 2026US 2026/0054287 A1University of North Texas
- Semiconductor package including stacked semiconductor chips25 Feb 2021US 2021/0057379 A1SK hynix Inc.
- Bonding method30 May 2019US 2019/0164928 A1Kaijo Corporation
- Connection pads for low cross-talk vertical wirebonds8 Nov 2018US 2018/0323173 A1Intel Corporation
Most cited
By later US patents