Electronic device by laser-induced forming and transfer of shaped metallic interconnects
AssigneeThe United States of America as represented by the Secretary of the Navy
InventorsScott A. Mathews, Iyoel Beniam, Alberto Piqué
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Abstract
An electronic device made from the method of providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, laser bending the shaped metallic interconnects; and transferring the shaped metallic interconnects onto a receiving substrate or device.
Claims9
An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, laser bending the shaped metallic interconnect;
- and transferring the shaped metallic interconnect onto a receiving substrate or device.
An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.
An electronic device made from the method of providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, laser bending the shaped metallic interconnects;
- and transferring the shaped metallic interconnects onto a receiving substrate or device.
Dependencies are inferred from the claim text.