Laser-induced forming and transfer of shaped metallic interconnects
AssigneeThe United States of America as represented by the Secretary of the Navy
InventorsScott A. Mathews, Iyoel Beniam, Alberto Piqué
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Abstract
A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.
Claims8
A method of forming and transferring shaped metallic interconnects, comprising:
- providing a donor substrate comprising an array of metallic interconnects;
- using a laser system to prepare the metallic interconnects;
- forming shaped metallic interconnects;
- laser bending the shaped metallic interconnect;
- and
- transferring the shaped metallic interconnect onto a receiving substrate or device.
A method of making an electronic device, comprising the steps of:
- providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate;
- providing a stencil to the metal structures on the donor substrate;
- applying a laser pulse through the donor substrate to the metal structures;
- directing the metal structures to an electronic device;
- applying conductive epoxy to the electronic device or to the metal structure prior to the step of directing the metal structures to an electronic device.
Dependencies are inferred from the claim text.