Connection pads for low cross-talk vertical wirebonds

A method, comprising:

• stacking a first die over a second die, the first die having a first bondpad and a second bondpad, wherein a width of the first bond pad is greater than a space between the first bondpad and the second bondpad, and wherein the first bondpad and second bondpad define a pitch between the first bondpad and the second bondpad, and wherein the width of the first bondpad is greater than half of the pitch;
• forming a first wirebond on the first bondpad;
• providing a first vertical wire substantially normal to the first bondpad for a first predetermined height, the first vertical wire connected to the first wirebond;
• forming a second wirebond on the second bondpad;
• providing a second vertical wire substantially normal to the second bondpad for a second predetermined height, the second vertical wire connected to the second wirebond;
• forming a molding surrounding the first die and the second die;
• and
• grinding the molding to expose a first tip of the first vertical wire and a second tip of the second vertical wire.