Semiconductor package including stacked semiconductor chips and method for fabricating the same

A method for fabricating a semiconductor package, comprising:

• forming a chip stack which includes first to Nth semiconductor chips having first to Nth chip pads, respectively, the first to Nth chip pads formed on active surfaces of the first to Nth semiconductor chips, respectively, and the first to Nth semiconductor chips sequentially stacked in a vertical direction such that the first to Nth chip pads are exposed, wherein N is a natural number equal to or more than 2;
• forming first to Nth vertical wires having first ends connected to the first to Nth chip pads, respectively, and extended in the vertical direction;
• forming a coating layer which surrounds portions of the first to kth vertical wires, extended from the first ends, among the first to Nth vertical wires, and connection portions between the first ends of the first to kth vertical wires and the first to kth chip pads, wherein k is a natural number equal to or more than 1 and equal to or less than (N−1);
• and
• forming a molding layer which covers the chip stack, surrounds the vertical wires, and covers the coating layer.