H10W 72/01515
Forming coatings
Official title: {Forming coatings}
H10W72/01515 (Forming coatings) appears on 1,985 US grants and 2,191 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,985
- Published applications
- 2,191
- Assignees
- 637
- Inventors
- 3,932
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 5 | 0 |
| 1986 | 2 | 0 |
| 1987 | 6 | 0 |
| 1988 | 5 | 0 |
| 1989 | 9 | 0 |
| 1990 | 5 | 0 |
| 1991 | 16 | 0 |
| 1992 | 9 | 0 |
| 1993 | 9 | 0 |
| 1994 | 11 | 0 |
| 1995 | 8 | 0 |
| 1996 | 13 | 0 |
| 1997 | 18 | 0 |
| 1998 | 20 | 0 |
| 1999 | 32 | 0 |
| 2000 | 30 | 0 |
| 2001 | 35 | 22 |
| 2002 | 33 | 66 |
| 2003 | 52 | 62 |
| 2004 | 52 | 85 |
| 2005 | 64 | 102 |
| 2006 | 45 | 118 |
| 2007 | 58 | 122 |
| 2008 | 50 | 135 |
| 2009 | 74 | 115 |
| 2010 | 91 | 119 |
| 2011 | 91 | 126 |
| 2012 | 104 | 122 |
| 2013 | 112 | 106 |
| 2014 | 127 | 125 |
| 2015 | 114 | 132 |
| 2016 | 115 | 107 |
| 2017 | 80 | 95 |
| 2018 | 91 | 67 |
| 2019 | 66 | 52 |
| 2020 | 61 | 83 |
| 2021 | 53 | 61 |
| 2022 | 55 | 74 |
| 2023 | 51 | 41 |
| 2024 | 55 | 26 |
| 2025 | 29 | 12 |
| 2026 | 16 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding wire for semiconductor devices8 Sep 2026US 12,733,530 B2Nippon Micrometal Corporation
- Imaging element package, method of manufacturing the same, and electronic device25 Aug 2026US 12,720,878 B2Sony Semiconductor Solutions Corporation
- Bonding wire for semiconductor devices25 Aug 2026US 12,721,208 B2Nippon Micrometal Corporation
- Semiconductor package including surface with reduced visual variation18 Aug 2026US 12,713,974 B2Samsung Electronics Co., Ltd.
- Through-substrate conductor support11 Aug 2026US 12,703,625 B2Texas Instruments Incorporated
- Stacked semiconductor die assemblies with die support members and associated systems and methods1 Oct 2026US 2026/0305487 A1Micron Technology, Inc.
- High bandwidth 3d mesh interconnect structure1 Oct 2026US 2026/0305499 A1Atum Works Inc.
- Substrate processing and packaging20 Aug 2026US 2026/0247989 A1Texas Instruments Incorporated
- Semiconductor devices and methods of manufacturing semiconductor devices20 Aug 2026US 2026/0248031 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor package20 Aug 2026US 2026/0248045 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Multiple encapsulation of phosphor-LED devices773US 5,959,316 AHewlett-Packard Company · 1999
- Wavelength-converting casting composition and its use749US 6,066,861 ASiemens Aktiengesellschaft · 2000
- Light emitting diode and method for fabricating the same489US 8,399,944 B2Samsung Electronics Co., Ltd. · 2013
- Light emitting diode and method for fabricating the same482US 8,536,604 B2Samsung Electronics Co., Ltd. · 2013
- Led lamp477US 6,577,073 B2Matsushita Electric Industrial Co., Ltd. · 2003