Through-substrate conductor support
AssigneeTexas Instruments Incorporated
InventorsVirgil Cotoco Ararao, John Charles Emhke
Life of this patent
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Abstract
In described examples, a first device on a first surface of a substrate is coupled to a structure arranged on a second surface of the substrate. In at least one example, a first conductor arranged on the first surface is coupled to circuitry of the first device. An elevated portion of the first conductor is supported by disposing an encapsulate and curing the encapsulate. The first conductor is severed by cutting the encapsulate and the first conductor. A second conductor is coupled to the first conductor. The second conductor is coupled to the structure arranged on the second surface of the substrate.
Claims20
A device comprising:
- a substrate having a first surface and a second surface opposite the first surface;
- circuitry on the first surface;
- a surface mounting contact structure on the second surface;
- a bond pad on the first surface of the substrate;
- a first conductor having a first end affixed to the bond pad, the first conductor electrically coupled to the circuitry, the first conductor having an elevated portion that includes a second end elevated with respect to the first surface and the bond pad;
- a supporting material between the first surface and the elevated portion;
- and
- a second conductor electrically coupling the second end to the surface mounting contact structure, the second conductor contacting the second end of the first conductor at an elevated position with respect to the first surface and the bond pad.
A device comprising:
- a substrate having a first surface, a second surface, and a third surface, the second surface opposite the first surface and the third surface connecting the first surface and the second surface, the third surface along an outer edge of the substrate;
- a bonding pad on the first surface;
- a first conductor having a first end electrically coupled to the bonding pad, the first conductor having a second end elevated with respect to the first surface and the bonding pad;
- and
- a second conductor on the second surface and along the third surface, the second conductor having a portion with an end extending above the first surface, the end of the second conductor electrically coupled to the second end of the first conductor.
A device comprising:
- a substrate having a first surface, a second surface, and a third surface, the second surface opposite the first surface and the third surface connecting the first surface and the second surface, the third surface along an outer edge of the substrate;
- a first conductor on the first surface, the first conductor having an elevated portion above the first surface, the elevated portion including an elevated end;
- a supporting material between the first surface and the elevated portion;
- and
- a second conductor on the second surface and along the third surface, the second conductor having a portion with an end extending above the first surface, the end of the second conductor electrically coupled to the elevated end of the elevated portion of the first conductor.
Dependencies are inferred from the claim text.