H10W 72/01565
Thermally treating
Official title: {Thermally treating}
H10W72/01565 (Thermally treating) appears on 116 US grants and 146 published applications in this corpus.
Search patents in H10W- Granted patents
- 116
- Published applications
- 146
- Assignees
- 49
- Inventors
- 218
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 2 |
| 2003 | 1 | 0 |
| 2004 | 0 | 3 |
| 2005 | 0 | 1 |
| 2006 | 0 | 2 |
| 2007 | 0 | 2 |
| 2008 | 1 | 4 |
| 2009 | 0 | 5 |
| 2010 | 2 | 10 |
| 2011 | 5 | 5 |
| 2012 | 5 | 8 |
| 2013 | 4 | 16 |
| 2014 | 5 | 7 |
| 2015 | 5 | 8 |
| 2016 | 10 | 6 |
| 2017 | 8 | 16 |
| 2018 | 9 | 10 |
| 2019 | 6 | 4 |
| 2020 | 8 | 7 |
| 2021 | 5 | 4 |
| 2022 | 4 | 7 |
| 2023 | 2 | 8 |
| 2024 | 6 | 8 |
| 2025 | 8 | 2 |
| 2026 | 4 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding wire for semiconductor devices8 Sep 2026US 12,733,530 B2Nippon Micrometal Corporation
- Bonding wire for semiconductor devices25 Aug 2026US 12,721,208 B2Nippon Micrometal Corporation
- AI bonding wire for semiconductor devices14 Jul 2026US 12,685,206 B2Nippon Micrometal Corporation
- Al bonding wire20 Jan 2026US 12,532,767 B2Nippon Micrometal Corporation
- AG alloy bonding wire for semiconductor devices and semiconductor device4 Nov 2025US 12,463,172 B2Nippon Micrometal Corporation
- Copper alloy bonding wire for semiconductor devices9 Apr 2026US 2026/0097454 A1Nippon Micrometal Corporation
- Bonding wire10 Apr 2025US 2025/0114877 A1Nippon Micrometal Corporation
- Ball-bond arrangement9 Jan 2025US 2025/0015037 A1Heraeus Materials Singapore Pte. Ltd.
- Coated round wire7 Nov 2024US 2024/0368794 A1Heraeus Materials Singapore Pte. Ltd.
- Bonding wire for semiconductor devices5 Sep 2024US 2024/0297142 A1Nippon Micrometal Corporation
Most cited
By later US patents
- Electronic component and method of manufacture123US 6,164,523 ASemiconductor Components Industries, LLC · 2000
- Superconducting bonds for thin film devices104US 5,110,034 AQuantum Magnetics, Inc. · 1992
- Superconducting bonds for thin film devices92US 5,139,192 AQuantum Magnetics, Inc. · 1992
- Copper bonding wire for semiconductor device and bonding structure thereof50US 8,653,668 B2Nippon Micrometal Corporation · 2014
- Bonding structure of multilayer copper bonding wire45US 8,836,147 B2Nippon Steel & Sumikin Materials Co., Ltd. · 2014