Bonding structure of multilayer copper bonding wire
AssigneeNippon Steel & Sumikin Materials Co., Ltd.
InventorsTomohiro Uno, Takashi Yamada, Atsuo Ikeda
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Abstract
A bonding structure of a ball-bonded portion is obtained by bonding a ball portion formed on a front end of a multilayer copper bonding wire. The multilayer copper bonding wire includes a core member that is mainly composed of copper, and an outer layer that is formed on the core member and is mainly composed of at least one noble metal selected from a group of Pd, Au, Ag and Pt. Further, a first concentrated portion of such noble metal(s) is formed in a ball-root region located at a boundary with the copper bonding wire in a surface region of the ball-bonded portion.
Claims29
A bonding structure of a ball-bonded portion obtained by bonding to a bonding-target portion a ball portion formed on a front end of a multilayer copper bonding wire, wherein
- said multilayer copper bonding wire comprises:
- a core member mainly composed of copper;
- and
- an outer layer formed on said core member and mainly composed of at least one noble metal selected from the group of Pd, Au, Ag and Pt,
- wherein said bonding structure comprises a first concentrated portion having a high total noble metal level and being formed in a ball-root region, said ball-root region being in such a surface region of said ball-bonded portion as is located at a boundary with said multilayer copper bonding wire,
- wherein said high total noble metal level accounts for all of said noble metals selected, and
- wherein a total concentration of said at least one noble metal selected in said first concentrated portion is not lower than 0.05 mol % and not higher than 6 mol %.
A bonding structure of a ball-bonded portion obtained by bonding to a bonding-target portion a ball portion formed on a front end of a multilayer copper bonding wire, wherein
- said multilayer copper bonding wire comprises:
- a core member mainly composed of copper;
- and
- an outer layer formed on said core member and mainly composed of at least one noble metal selected from the group of Pd, Au, Ag and Pt, wherein
- said bonding structure comprises:
- a first concentrated portion having a high total noble metal level and being formed in a ball-root region, said ball-root region being in such a surface region of said ball-bonded portion as is located at a boundary with said multilayer copper bonding wire;
- and
- a second concentrated portion in which said at least one noble metal is highly concentrated, said second concentrated portion being formed in at least one location inside said ball-bonded portion when observed on said cross section of said ball-bonded portion taken along said plane orthogonal to said bonded interface between said ball-bonded portion and said bonding-target portion.
A bonding structure of a ball-bonded portion obtained by bonding to a bonding-target portion a ball portion formed on a front end of a multilayer copper bonding wire, wherein
- said multilayer copper bonding wire comprises:
- a core member mainly composed of copper;
- and
- an outer layer formed on said core member and mainly composed of at least one noble metal selected from the group of Pd, Au, Ag and Pt, wherein
- said bonding structure comprises:
- a first concentrated portion having a high total noble metal level and being formed in a ball-root region, said ball-root region being in such a surface region of said ball-bonded portion as is located at a boundary with said multilayer copper bonding wire;
- and
- a third concentrated portion in which said at least one noble metal is highly concentrated, said third concentrated portion being formed in said bonded interface between said ball-bonded portion and said bonding-target portion.
Dependencies are inferred from the claim text.