Coated round wire
AssigneeHeraeus Materials Singapore Pte. Ltd.
InventorsMiew Wan LO, Murali SARANGAPANI, Yong Sheng WANG
Life of this patent
Estimating the term…
Loading patent…
AssigneeHeraeus Materials Singapore Pte. Ltd.
InventorsMiew Wan LO, Murali SARANGAPANI, Yong Sheng WANG
Estimating the term…
A round wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself is a silver-based wire core, wherein the coating layer is a double-layer comprised of a 1 to 100 nm thick inner layer of palladium or nickel and an adjacent 1 to 250 nm thick outer layer of gold, wherein the outer layer of gold exhibits at least one of the following intrinsic properties A1) and A2): A1) the average grain size of the crystal grains in the outer layer of gold, measured in longitudinal direction, is in the range of 0.1 to 0.8 μm; A2) 60 to 100% of the crystal grains in the outer layer of gold are oriented in <100> direction, and 0 to 20% of the crystal grains in the outer layer of gold are oriented in <111> direction.
A round wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself is a silver-based wire core, wherein the coating layer is a double-layer comprised of a 1 to 100 nm thick inner layer of palladium or nickel and an adjacent 1 to 250 nm thick outer layer of gold, wherein the outer layer of gold exhibits at least one of the following intrinsic properties A 1) and A2):
Dependencies are inferred from the claim text.