Superconducting bonds for thin film devices
AssigneeQuantum Magnetics, Inc.
InventorMichael B. Simmonds
Life of this patent
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Abstract
A method of bonding a superconductive ribbon lead to a superconducting bonding pad connected to superconducting circuitry. The thin ribbon is first coated with a fresh layer of the same material from which it is made and then a very thin layer of a noble metal is applied over that fresh layer. The bonding pad is also prepared with a very thin layer of the noble metal. Those coated surfaces are placed in facing contact and ultrasonically bonded.
Claims26
A method of bonding a superconductive electrical lead to a superconductive thin film pad on a substrate, said method comprising the steps of:
- forming a thin film bonding pad of superconductive material on the substrate, the pad having a contact surface;
- forming a thin ribbon of similar superconductive material, the ribbon having a facing surface;
- coating at least one of the pad contact surface and the ribbon facing surface with a very thin layer of a different material which readily coheres to the superconductive surface material;
- placing the different-material coated surface in contact with the c her superconductive material surface;
- and then
- bonding the thin ribbon to the bonding pad.
A method of bonding a superconductive electrical lead to a superconductive thin film pad on an electrically insulating substrate, said method comprising the steps of:
- forming a thin film bonding pad of niobium on the substrate, the pad having a contact surface;
- forming a thin ribbon of niobium, the ribbon having a facing surface;
- coating at least one of the niobium pad contact surface and ribbon facing surface with a very thin layer of palladium;
- placing the palladium coated surface and the niobium surface of the other element in contact;
- and then
- ultrasonically bonding the thin ribbon to the bonding pad.
Dependencies are inferred from the claim text.