Elevated interposer for wire bonding in stacked semiconductor devices, and associated systems and methods

A semiconductor device package, comprising:

• a base substrate having a front surface;
• a controller integrated with the front surface;
• a redistribution interposer carried by the front surface of the base substrate over the controller;
• and
• a wing-shaped die stack carried by the front surface adjacent to the controller, wherein:
• a first portion of the wing-shaped die stack is coupled to the controller via a first communication path;
• and
• a second portion of the wing-shaped die stack is coupled to the controller via a second communication path different from the first communication path, wherein the second communication path comprises one or more route lines in the redistribution interposer.

A method for manufacturing a stacked semiconductor device, the method comprising:

• integrating a controller with an active surface of a base substrate;
• integrating a redistribution layer interposer with the active surface of the base substrate;
• and
• for each of two or more die wings:
• stacking a first portion of the two or more die wings on the active surface of the base substrate adjacent to the controller;
• forming first wire bonds between the first portion and one or more first bond pads on the active surface of the base substrate;
• stacking a second portion of the two or more die wings on the first portion of the two or more die wings;
• and
• forming second wire bonds between the second portion and one or more second bond pads on an upper surface of the redistribution layer interposer.