H10W 72/01571
Cleaning
Official title: {Cleaning, e.g. oxide removal or de-smearing}
H10W72/01571 (Cleaning) appears on 169 US grants and 186 published applications in this corpus.
Search patents in H10W- Granted patents
- 169
- Published applications
- 186
- Assignees
- 108
- Inventors
- 458
- Latest grant
- 10 Sep 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 8 | 8 |
| 2002 | 7 | 10 |
| 2003 | 9 | 8 |
| 2004 | 6 | 11 |
| 2005 | 6 | 12 |
| 2006 | 4 | 9 |
| 2007 | 5 | 10 |
| 2008 | 9 | 14 |
| 2009 | 6 | 14 |
| 2010 | 4 | 10 |
| 2011 | 8 | 3 |
| 2012 | 8 | 6 |
| 2013 | 5 | 5 |
| 2014 | 4 | 6 |
| 2015 | 7 | 5 |
| 2016 | 5 | 8 |
| 2017 | 6 | 7 |
| 2018 | 5 | 10 |
| 2019 | 10 | 6 |
| 2020 | 3 | 6 |
| 2021 | 5 | 6 |
| 2022 | 7 | 7 |
| 2023 | 3 | 0 |
| 2024 | 3 | 1 |
| 2025 | 0 | 3 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Systems and methods related to wire bond cleaning and wire bonding recovery10 Sep 2024US 12,087,728 B2Skyworks Solutions, Inc.
- Laminate stacked on die for high voltage isolation capacitor26 Mar 2024US 11,942,402 B2Texas Instruments Incorporated
- Ruthenium-etching solution, method for manufacturing ruthenium-etching solution, method for processing object to be processed, and method for manufacturing ruthenium-containing wiring13 Feb 2024US 11,898,081 B2Tokyo Ohka Kogyo.Co., Ltd.
- Molded semiconductor package with high voltage isolation14 Nov 2023US 11,817,407 B2Infineon Technologies AG
- Method of manufacturing a resin-sealed semiconductor device18 Jul 2023US 11,705,344 B2Renesas Electronics Corporation
- Passivation coating on copper metal surface for copper wire bonding application26 Feb 2026US 2026/0054287 A1University of North Texas
- Semiconductor device and method of manufacturing the same19 Jun 2025US 2025/0201673 A1Renesas Electronics Corporation
- Electronic component and method for cleaning bonding tool27 Mar 2025US 2025/0100025 A1Murata Manufacturing Co., Ltd.
- Systems and methods related to wire bond cleaning and wire bonding recovery13 Mar 2025US 2025/0087631 A1Skyworks Solutions, Inc.
- Semiconductor package including dam structure and method of fabricating the same28 Nov 2024US 2024/0395760 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Method for adding plasma treatment on bond pad to prevent bond pad staining problems353US 6,214,717 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2001
- Wire bonding process for copper-metallized integrated circuits132US 6,800,555 B2Texas Instruments Incorporated · 2004
- Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides60US 7,372,141 B2STATS ChipPAC, Ltd. · 2008
- Bonding pads for integrated circuits having copper interconnect metallization50US 6,329,722 B1Texas Instruments Incorporated · 2001
- Method to remove fluorine residues from bond pads48US 5,380,401 AMicron Technology, Inc. · 1995