Bonding pads for integrated circuits having copper interconnect metallization
AssigneeTexas Instruments Incorporated
InventorsWei-Yan Shih, Arthur Wilson, Willmar Subido
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Abstract
A device having a thin metallic coating, such as tin which forms strong bonds to copper is provided on the bond pads of an integrated circuit having copper metallization; surface oxidation of the coating is self limiting and the oxides are readily removed, further the coated bond pad forms intermetallics at low temperatures making it both solderable and compatible with wire bonding. A low cost process for forming tin coated copper bonding pads is provided by electroless plating.
Claims2
An integrated circuit having copper interconnect metallization which includes an array of bonding pads, said bonding pads consisting essentially of copper and a coating of tin on the copper;
- and a bond wire attached to at least one of said bonding pads.
Dependencies are inferred from the claim text.