Method of manufacturing a resin-sealed semiconductor device
AssigneeRenesas Electronics Corporation
InventorsMasakatsu Suzuki, Haruhiko Harada, Yasuhiko Akaike
Life of this patent
Estimating the term…
Abstract
A technique capable of shortening process time for plasma cleaning is provided. A method of manufacturing a semiconductor device includes a step of preparing a substrate including a plurality of device regions each including a semiconductor chip electrically connected to a plurality of terminals formed on a main surface by a wire, a step of delivering the substrate while emitting plasma generated in atmospheric pressure to the main surface of the substrate, a step of delivering the substrate while capturing an image of a region of the main surface of the substrate and a step of forming a sealing body by sealing the semiconductor chip and the wire with a resin.
Claims10
A method of manufacturing a semiconductor device, the method comprising the steps of:
- (a) preparing a substrate including a plurality of device regions each including a plurality of terminals formed on a main surface and a semiconductor chip mounted on the main surface and electrically connected to the terminal by a wire;
- (b) after the step (a), delivering the substrate while emitting plasma generated in atmospheric pressure to a region of the main surface of the substrate;
- (c) after the step (b), delivering the substrate while capturing an image of the region of the main surface of the substrate;
- and
- (d) after the step (c), forming a sealing body by sealing the semiconductor chip and the wire with a resin,
- wherein, in the step (b), the substrate is delivered in a state in which the main surface of the substrate faces downward while the plasma generated in atmospheric pressure is emitted from below to the region of the main surface of the substrate,
- wherein, in the step (c), the substrate is delivered in a state in which the main surface of the substrate faces downward while an image of the region of the main surface of the substrate is captured from below, and
- wherein, in the step (d), the sealing body is formed by sealing the semiconductor chip and the wire with the resin in the state in which the main surface of the substrate faces downward.
A method of manufacturing a semiconductor device, the method comprising the steps of:
- loading a substrate into a semiconductor manufacturing apparatus including:
- a loader unit into which the substrate is loaded, the substrate including a plurality of device regions each including a plurality of terminals formed on a main surface and a semiconductor chip mounted on the main surface and electrically connected to the terminal by a wire;
- a substrate delivery unit delivering the substrate;
- a plasma generating unit arranged so as to face the main surface of the substrate and generating plasma in atmosphere;
- a recognition camera arranged so as to face the main surface of the substrate and capturing images of the substrate, the semiconductor chip and the wire;
- and a molding unit forming a sealing body by sealing the semiconductor chip and the wire with a resin;
- delivering the substrate from the loader unit to the recognition camera by using the substrate delivery unit in a state in which the main surface of the substrate faces downward, and at the same time, emitting the plasma to the region of the main surface of the substrate by using the plasma generating unit;
- delivering the substrate from the plasma generating unit to the molding unit by using the substrate delivery unit in the state in which the main surface of the substrate faces downward, and at the same time, capturing an image of the region of the main surface of the substrate by using the recognition camera;
- and
- forming a sealing body by sealing the semiconductor chip and the wire with a resin in the state in which the main surface of the substrate faces downward.
Dependencies are inferred from the claim text.