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US 12,087,728 B2Granted
Systems and methods related to wire bond cleaning and wire bonding recovery
AssigneeSkyworks Solutions, Inc.
InventorsAldrin Quinones Garing, Miguel Camargo Soto
Life of this patent
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Abstract
Methods, systems and devices are disclosed for performing a semiconductor processing operation. In some embodiments this includes configuring a wire bonding machine to perform customized movements with a capillary tool of the wire bonding machine, etching bulk contaminants over one or more locations of a semiconductor device with the capillary tool, and applying plasma to the semiconductor device to remove residual contaminants.
Claims20
A method for performing a semiconductor processing operation, comprising:
- configuring a wire bonding machine such that the wire bonding machine performs customized cleaning movements with a capillary tool of the wire bonding machine, the configuring the wire bonding machine including configuring the capillary tool based on location-based parameters and pattern-based parameters relating to performing the customized cleaning movements, the pattern-based parameters defining one or more movements to etch contaminants with the capillary tool;
- detecting one or more locations of a semiconductor device including the contaminants;
- filtering out detected contaminants that are less than a predetermined size;
- and
- etching the contaminants of at least the predetermined size over the one or more locations of the semiconductor device with the capillary tool, an etching pressure based on a speed of the customized cleaning movements of the capillary tool and a type of the contaminant.
2 more elements
Dependencies are inferred from the claim text.