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US 2025/0087631 A1Published application
Systems and methods related to wire bond cleaning and wire bonding recovery
AssigneeSkyworks Solutions, Inc.
InventorsAldrin Quinones GARING, Miguel CAMARGO SOTO
Life of this patent
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Abstract
Systems, methods, and devices are disclosed for performing a semiconductor processing operation. In some embodiments, a system for performing a semiconductor processing operation can include a wire-bonding machine with a capillary tool, the wire-bonding machine configured to etch bulk contamination at one or more locations on a semiconductor device with the capillary tool, followed by application of plasma to the semiconductor device to remove residual contamination.
Claims20
A system for performing a semiconductor processing operation, comprising:
- a wire-bonding machine including a capillary tool, the capillary tool of the wire-bonding machine configured based on location-based parameters and pattern-based parameters such that the wire-bonding machine performs customized cleaning movements with the capillary tool, the pattern-based parameters defining one or more movements to etch contaminants with the capillary tool, the wire-bonding machine further configured to:
- detect one or more locations of a semiconductor device including the contaminants;
- filter out detected contaminants that are less than a predetermined size;
- and
- etch the contaminants of at least the predetermined size over the one or more locations of the semiconductor device with the capillary tool, an etching pressure based on a speed of the customized cleaning movements of the capillary tool and a type of contaminant.
2 more elements
Dependencies are inferred from the claim text.