Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides

A method for making a stacked package assembly, comprising:

• providing a cavity molded LGA package;
• applying an adhesive onto the surface of the mold cap of the LGA package;
• providing a singulated CSP;
• inverting the CSP and placing the inverted CSP onto the adhesive on the LGA mold cap;
• curing the adhesive;
• performing a plasma clean following curing the adhesive;
• wire bonding to form z-interconnection between the die attach side of the LGA and the land side of the CSP;
• performing a plasma clean following wire bonding;
• performing a molding operation to enclose the die attach side of the LGA, the z-interconnection wire bonds and wire loops, the edges of the CSP, and a marginal area on the land side of the CSP, leaving exposed the land side of the LGA substrate and an area of the land side of the CSP substrate located within the marginal area;
• and attaching second level interconnect solder balls to sites on the exposed area of the CSP substrate.

A method for making a stacked package assembly, comprising:

• providing a cavity molded LGA package;
• applying an adhesive onto the surface of the mold cap of the LGA package;
• providing a singulated CSP;
• inverting the CSP and placing the inverted CSP onto the adhesive on the LGA mold cap;
• curing the adhesive;
• performing a plasma clean following curing the adhesive;
• wire bonding to form z-interconnection between the die attach side of the LGA and the land side of the CSP;
• performing a plasma clean following wire bonding;
• performing a molding operation to enclose the die attach side of the LGA, the z-interconnection wire bonds and wire loops, the edges of the CSP, and a marginal area on the land side of the CSP, leaving exposed the land side of the LGA substrate and an area of the land side of the CSP substrate located within the marginal area;
• and attaching second level interconnect solder balls to sites on the exposed side of the LGA package substrate.

A method for making a stacked package assembly comprising:

• providing an LGA substrate;
• mounting and electrically connecting a die onto a die attach side of the LGA substrate;
• applying an adhesive onto the die on the LGA substrate;
• providing a singulated CSP;
• inverting the CSP and placing the inverted CSP onto the adhesive on the die on the LGA substrate;
• curing the adhesive;
• performing a plasma clean following curing the adhesive;
• wire bonding to form z-interconnection between the die attach side of the LGA substrate and the land side of the CSP;
• performing a plasma clean following wire bonding;
• performing a molding operation to enclose the die attach side of the LGA, the z-interconnection wire bonds and wire loops, the edges of the CSP, and a marginal area on the land side of the CSP, leaving exposed the land side of the LGA substrate and an area of the land side of the CSP substrate located within the marginal area;
• and attaching second level interconnect solder balls to sites on the exposed land side of the LGA substrate.