H10W 72/01551
Changing the shapes of bond wires
Official title: {Changing the shapes of bond wires}
H10W72/01551 (Changing the shapes of bond wires) appears on 830 US grants and 795 published applications in this corpus.
Search patents in H10W- Granted patents
- 830
- Published applications
- 795
- Assignees
- 254
- Inventors
- 1,526
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 7 | 0 |
| 1990 | 8 | 0 |
| 1991 | 9 | 0 |
| 1992 | 10 | 0 |
| 1993 | 6 | 0 |
| 1994 | 5 | 0 |
| 1995 | 15 | 0 |
| 1996 | 8 | 0 |
| 1997 | 12 | 0 |
| 1998 | 11 | 0 |
| 1999 | 28 | 0 |
| 2000 | 21 | 0 |
| 2001 | 46 | 26 |
| 2002 | 39 | 31 |
| 2003 | 20 | 31 |
| 2004 | 20 | 31 |
| 2005 | 19 | 37 |
| 2006 | 22 | 17 |
| 2007 | 13 | 35 |
| 2008 | 16 | 32 |
| 2009 | 19 | 37 |
| 2010 | 32 | 62 |
| 2011 | 35 | 31 |
| 2012 | 38 | 33 |
| 2013 | 30 | 38 |
| 2014 | 20 | 34 |
| 2015 | 30 | 32 |
| 2016 | 40 | 40 |
| 2017 | 30 | 37 |
| 2018 | 29 | 30 |
| 2019 | 21 | 24 |
| 2020 | 22 | 25 |
| 2021 | 18 | 27 |
| 2022 | 23 | 35 |
| 2023 | 22 | 23 |
| 2024 | 28 | 21 |
| 2025 | 20 | 16 |
| 2026 | 9 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bonding wire for semiconductor devices8 Sep 2026US 12,733,530 B2Nippon Micrometal Corporation
- Bonding wire for semiconductor devices25 Aug 2026US 12,721,208 B2Nippon Micrometal Corporation
- Semiconductor device with wire including a surface metal layer covering a core metal11 Aug 2026US 12,708,043 B2Rohm Co., Ltd.
- Apparatus and methods for tool mark free stitch bonding7 Jul 2026US 12,677,378 B2Skyworks Solutions, Inc.
- Output matching network to reduce self and mutual inductances of output inductive components in a cavity package2 Jun 2026US 12,648,489 B2Sumitomo Electric Device Innovations, Inc.
- Automatic wire threading method and system27 Aug 2026US 2026/0250097 A1Asmpt Singapore Pte. Ltd.
- Electronic Assembly, Electronic Device, and Preparation Method for Electronic Assembly6 Aug 2026US 2026/0231809 A1Huawei Technologies Co., Ltd.
- Al connection material16 Jul 2026US 2026/0200018 A1Nippon Micrometal Corporation
- Al connection material16 Jul 2026US 2026/0201510 A1Nippon Micrometal Corporation
- Packages with electrical fuses25 Jun 2026US 2026/0179869 A1
Most cited
By later US patents
- Semiconductor device475US 6,316,838 B1Fujitsu Limited · 2001
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Method of fabricating an interconnection element335US 6,336,269 B12002