Al CONNECTION MATERIAL
AssigneesNippon Steel Chemical & Material Co., Ltd., Nippon Micrometal Corporation
InventorsTomohiro UNO, Tetsuya OYAMADA, Daizo ODA, Motoki ETO, Yuya SUTO
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AssigneesNippon Steel Chemical & Material Co., Ltd., Nippon Micrometal Corporation
InventorsTomohiro UNO, Tetsuya OYAMADA, Daizo ODA, Motoki ETO, Yuya SUTO
Estimating the term…
To provide an Al connection material that may suppress generation of internal cracks at the time of manufacture and exhibits excellent temperature cycle reliability. An Al connection material containing 3.0% by mass or more and 12.0% by mass or less of Si, in which an average value of a ratio between a short side length c and a long side length d (c/d) of an Al phase in an L cross-section (cross section in a center axis direction including a center axis) of the Al connection material is equal to or larger than 0.25 and equal to or smaller than 0.7, and an average value of a ratio between a short side length e and a long side length f (e/f) of a Si phase in the L cross-section of the Al connection material is equal to or larger than 0.2 and equal to or smaller than 0.7.
An Al connection material containing 3.0% by mass or more and 12.0% by mass or less of Si, and the balance consisting of Al and inevitable impurities, wherein
The Al connection material according to claim 15, further containing 10 mass ppm or more and 800 mass ppm or less of one or more of Sr, Ca, Na, Ti, and P in total.
The Al connection material according to claim 15, further containing 10 mass ppm or more and 500 mass ppm or less of one or more of Mn, Sn, Cu, and Zn in total.
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The Al connection material according to claim 15, wherein a total concentration of elements other than Al, Si, Sr, Ca, Na, Ti, P, Mn, Sn, Cu, and Zn is equal to or smaller than 0.5% by mass.
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An Al connection material containing 3.0% by mass or more and 12.0% by mass or less of Si, 850 mass ppm or less of one or more of Sr, Ca, Na, Ti, and P in total, and the balance consisting of Al and inevitable impurities, wherein
An Al connection material containing 3.0% by mass or more and 12.0% by mass or less of Si, 600 mass ppm or less of one or more of Mn, Sn, Cu, and Zn in total, and the balance consisting of Al and inevitable impurities, wherein
An Al connection material containing 3.0% by mass or more and 12.0% by mass or less of Si, 850 mass ppm or less of one or more of Sr, Ca, Na, Ti, and P in total, 600 mass ppm or less of one or more of Mn, Sn, Cu, and Zn in total, and the balance consisting of Al and inevitable impurities, wherein
An Al connection material for a semiconductor device containing 3.0% by mass or more and 12.0% by mass or less of Si, wherein
Dependencies are inferred from the claim text.