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US 2026/0200018 A1Published application
Al CONNECTION MATERIAL
AssigneesNippon Steel Chemical & Material Co., Ltd., Nippon Micrometal Corporation
InventorsTomohiro UNO, Daizo ODA, Motoki ETO, Yuya SUTO
Life of this patent
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Abstract
To provide an Al connection material that may suppress generation of internal cracks at the time of manufacture and exhibits excellent temperature cycle reliability. The Al connection material containing 3.0% by mass or more and 12.0% by mass or less of Si, and containing 5 mass ppm or more and 800 mass ppm or less of one or more of Sr, Na, Eu, and Ca in total.
Claims16
An Al connection material containing:
- 3.0% by mass or more and 12.0% by mass or less of Si;
- and
- 5 mass ppm or more and 800 mass ppm or less of one or more of Sr, Na, Eu, and Ca in total.
Dependencies are inferred from the claim text.