Output matching network to reduce self and mutual inductances of output inductive components in a cavity package

A semiconductor device, comprising:

• a cavity package including a substrate and at least one output lead disposed higher than the substrate, when viewed in a side view, to create a cavity;
• a transistor die disposed within the cavity, a top surface of the transistor die being lower than a top surface of the output lead when viewed in the side view;
• a first matching network disposed within the cavity and separate from the transistor die, a top surface of the first matching network being lower than the top surface of the output lead when viewed in the side view;
• a shunt wire configured to connect an output of the transistor die to the first matching network;
• and
• an output wire configured to connect the output of the transistor die to the output lead of the cavity package,
• wherein a first position of the output wire is lower than a second position of the shunt wire above the first matching network, when viewed in the side view.