H10W 72/01553
By etching
Official title: {by etching}
H10W72/01553 (By etching) appears on 9 US grants and 12 published applications in this corpus.
Search patents in H10W- Granted patents
- 9
- Published applications
- 12
- Assignees
- 6
- Inventors
- 31
- Latest grant
- 8 Oct 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 2 |
| 2016 | 1 | 4 |
| 2017 | 3 | 0 |
| 2018 | 0 | 1 |
| 2019 | 1 | 1 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 2 | 1 |
By publication year.
Recent patents
- Method for preparing semiconductor device with wire bond8 Oct 2024US 12,113,046 B2Nanya Technology Corporation
- Method for preparing semiconductor device with wire bond16 Jan 2024US 11,876,072 B2Nanya Technology Corporation
- Package device, semiconductor device, and method for manufacturing the package device18 Feb 2020US 10,566,279 B2Advanced Semiconductor Engineering, Inc.
- Mixed impedance leads for die packages and method of making the same2 Jul 2019US 10,340,209 B2Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Die package with low electromagnetic interference interconnection21 Nov 2017US 9,824,997 B2Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Method for preparing semiconductor device with wire bond22 Feb 2024US 2024/0063175 A1Nanya Technology Corporation
- Method for preparing semiconductor device with wire bond2 Mar 2023US 2023/0061312 A1Nanya Technology Corporation
- Package device, semiconductor device, and method for manufacturing the package device25 Jul 2019US 2019/0229054 A1Advanced Semiconductor Engineering, Inc.
- Wiring system5 Apr 2018US 2018/0098437 A1The Charles Stark Draper Laboratory, Inc.
- Die package with low electromagnetic interference interconnection29 Dec 2016US 2016/0379954 A1Rosenberger Hochfrequenztechnik GmbH & Co. KG
Most cited
By later US patents