Die package with low electromagnetic interference interconnection
AssigneeRosenberger Hochfrequenztechnik GmbH & Co. KG
InventorsSean S. Cahill, Eric A. Sanjuan
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Abstract
A die package having lead structures connecting to a die that provide for electromagnetic interference reductions. Mixed impedance leads connected to the die have a first lead with a first metal core, a dielectric layer surrounding the first metal core, and first outer metal layer connected to ground; and a second lead with a second metal core, and a second dielectric layer surrounding the second metal core, and a second outer metal layer connected to ground. Each lead reducing susceptibility to EMI and crosstalk.
Claims23
A die package comprising:
- a die having a plurality of connection pads;
- a die substrate supporting a plurality of connection elements;
- a first lead having a first metal core with a first metal core diameter, a first dielectric layer surrounding said first metal core having a first dielectric thickness, and a first outer metal layer surrounding said first dielectric layer, said first outer metal layer attached to a first ground plane;
- and
- a second lead having a second metal core with a second metal core diameter, a second dielectric layer surrounding said second metal core having a second dielectric thickness, and a second outer metal layer surrounding said second dielectric layer, said second outer metal layer attached to a second ground plane;
- such that susceptibility to EMI and crosstalk between the first and second leads are reduced.
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A BGA package with superior EMI performance including a die package comprising a plurality of leads, each having a metal core, a dielectric layer surrounding the metal core, an outer metal layer connected to ground, with crosstalk noise reduced at least 5 dB as compared to leads without a dielectric layer surrounding the metal core and having an outer metal layer, wherein said die package includes:
- a die having a plurality of connection pads;
- a die substrate supporting a plurality of connection elements;
- at least a first lead having a first metal core with a first metal core diameter, a first dielectric layer surrounding said first metal core having a first dielectric thickness, and a first outer metal layer surrounding said first dielectric layer, said first outer metal layer attached to a first ground plane;
- and
- at least a second lead having a second metal core with a second metal core diameter, a second dielectric layer surrounding said second metal core having a second dielectric thickness, and a second outer metal layer surrounding said second dielectric layer, said second outer metal layer attached to a second ground plane.
Dependencies are inferred from the claim text.