Mixed impedance leads for die packages and method of making the same

A method of making a die package wherein said die package comprises:

• a die having a plurality of connection pads;
• a die substrate supporting a plurality of connection elements;
• a first lead connected to at least one connection pad and having a first metal core with a first core diameter, and a dielectric layer surrounding the first metal core having a first dielectric thickness;
• and
• a second lead connected to at least one connection pad and having a second metal core with a second core diameter, and a dielectric layer surrounding the second metal core having a second dielectric thickness, with the first dielectric thickness differing from the second dielectric thickness,
• wherein the first lead has a first impedance and the second lead has a second impedance different from said first impedance, and
• wherein at least one of the dielectric layers includes multiple layers of different dielectric compositions including a vapor barrier layer deposited over a second dielectric layer and being thinner than the second dielectric layer;
• said method comprising:
• providing a die and a die substrate having connection pads;
• connecting said die to said die substrate connection pads via a first wirebond having a first diameter metal core;
• connecting said die to said die substrate connection pads via a second wirebond having a second diameter metal core;
• depositing at least one layer of dielectric on said wirebond first diameter metal core and on said wirebond second diameter metal core, the dielectric thicknesses differing from each other;
• and
• metalizing said at least one layer of dielectric on said first diameter metal core and on said second diameter metal core, for creating two leads having different impedances, wherein said step of depositing at least one layer of dielectric includes depositing multiple layers of different dielectric compositions including said vapor barrier layer deposited over said second dielectric layer and being thinner than the second dielectric layer, on said first wirebond and/or on said second wirebond.