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US 9,824,997 B2Granted
Die package with low electromagnetic interference interconnection
AssigneeRosenberger Hochfrequenztechnik GmbH & Co. KG
InventorsSean S. Cahill, Eric A. Sanjuan
Life of this patent
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Abstract
A die package having lead structures connecting to a die that provide for electromagnetic interference reductions. Mixed impedance leads connected to the die have a first lead with a first metal core, a dielectric layer surrounding the first metal core, and first outer metal layer connected to ground; and a second lead with a second metal core, and a second dielectric layer surrounding the second metal core, and a second outer metal layer connected to ground. Each lead reducing susceptibility to EMI and crosstalk.
Claims17
A die package comprising:
- a die having a plurality of connection pads;
- a die substrate supporting a plurality of connection elements;
- a first lead having a first metal core with a first metal core diameter, a first dielectric layer surrounding said first metal core having a first dielectric thickness, and a first outer metal layer surrounding said first dielectric layer, said first outer metal layer attached to a first ground plane;
- and
- a second lead having a second metal core with a second metal core diameter, a second dielectric layer surrounding said second metal core having a second dielectric thickness, and a second outer metal layer surrounding said second dielectric layer, said second outer metal layer attached to a second ground plane;
- such that susceptibility to EMI and crosstalk between the first and second leads are reduced, wherein the first ground plane is separate and distinct from the second ground plane.
3 more elements
A die package comprising:
- a die having a plurality of connection pads;
- a die substrate supporting a plurality of connection elements;
- a first lead having a first metal core with a first metal core diameter, a first dielectric layer surrounding said first metal core having a first dielectric thickness, and a first outer metal layer surrounding said first dielectric layer, said first outer metal layer attached to a first ground plane;
- and
- a second lead having a second metal core with a second metal core diameter, a second dielectric layer surrounding said second metal core having a second dielectric thickness, and a second outer metal layer surrounding said second dielectric layer, said second outer metal layer attached to a second ground plane;
- such that susceptibility to EMI and crosstalk between the first and second leads are reduced;
- wherein the first ground plane is separate and distinct from the second ground plane;
- wherein the first lead extends from a first die to one of the plurality of connection elements on the die substrate, and the second lead extends from a second die to one of the plurality of connection elements on the die substrate, the first ground plane attached to said first outer metal layer and the second ground plane attached to said second outer metal layer;
- and
- wherein the second ground plane overlays the first ground plane with an intervening layer maintaining electrical isolation between the first and second ground plane.
7 more elements
A BGA package with superior EMI performance including a die package comprising:
- a die having a plurality of connection pads;
- a die substrate supporting a plurality of connection elements;
- a first lead having a first metal core with a first metal core diameter, a first dielectric layer surrounding said first metal core having a first dielectric thickness, and a first outer metal layer surrounding said first dielectric layer, said first outer metal layer attached to a first ground plane;
- and
- a second lead having a second metal core with a second metal core diameter, a second dielectric layer surrounding said second metal core having a second dielectric thickness, and a second outer metal layer surrounding said second dielectric layer, said second outer metal layer attached to a second ground plane;
- such that susceptibility to EMI and crosstalk between the first and second leads are reduced wherein said crosstalk noise is reduced at least 5 dB as compared to leads without a dielectric layer surrounding the metal core and having an outer metal layer,
- wherein the first ground plane is separate and distinct from the second ground plane.
4 more elements
A die package comprising:
- a die having a plurality of connection pads;
- a die substrate supporting a plurality of connection elements;
- a first lead having a first metal core with a first metal core diameter, a first dielectric layer surrounding said first metal core having a first dielectric thickness, and a first outer metal layer surrounding said first dielectric layer, said first outer metal layer attached to a first ground plane;
- and
- a second lead having a second metal core with a second metal core diameter, a second dielectric layer surrounding said second metal core having a second dielectric thickness, and a second outer metal layer surrounding said second dielectric layer, said second outer metal layer attached to a second ground plane;
- such that susceptibility to EMI and crosstalk between the first and second leads are reduced, and wherein the first ground plane and the second ground plane are electrically distinct, but physically overlap.
3 more elements
Dependencies are inferred from the claim text.