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US 9,324,675 B2Granted
Structures for reducing corrosion in wire bonds
AssigneeFreescale Semiconductor, Inc.
InventorsBurton J. Carpenter, Chu-Chung Lee, Tu-Anh N. Tran
Life of this patent
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Abstract
A semiconductor structure includes a bond pad and a wire bond coupled to the bond pad. The wire bond includes a bond in contact with the bond pad. The wire bond includes a coating on a surface of the wire bond, and a first exposed portion of the wire bond in a selected location. The wire bond is devoid of the coating over the selected location of the wire bond, and an area of the first exposed portion is at least one square micron.
Claims10
A semiconductor structure comprising:
- a bond pad, and
- a wire bond coupled to the bond pad, wherein
- the wire bond includes a bond in contact with the bond pad,
- the wire bond includes a coating on a surface of the wire bond;
- and
- a first exposed portion of the wire bond in a selected location, wherein
- the wire bond is devoid of the coating over the selected location of the wire bond, and
- an area of the first exposed portion is at least one square micron;
- wherein the wire bond includes one or more exposures in the coating in proximity to the first exposed portion of the wire bond.
6 more elements
A semiconductor structure comprising:
- a plurality of bond pads aligned along an edge of the semiconductor structure, and
- a plurality of wire bonds coupled to the plurality of bond pads, wherein
- each of the plurality of wire bonds includes a bond in contact with one of the plurality of bond pads, and
- each of the plurality of wire bonds includes a coating on a respective wire bond surface;
- and
- a plurality of exposed portions within a selected area, wherein
- the selected area spans across the plurality of wire bonds in a direction along the edge of the semiconductor structure,
- each of the plurality of wire bonds includes at least one exposed portion of the plurality of exposed portions, and
- each of the plurality of wire bonds is devoid of the coating over the at least one exposed portion,
- wherein the semiconductor structure further includes one or more additional exposed portions, wherein the wire bond is devoid of the coating over the one or more additional exposed portions.
7 more elements
Dependencies are inferred from the claim text.