H10W 72/013
Of die-attach connectors
Official title: {of die-attach connectors}
H10W72/013 (Of die-attach connectors) appears on 4,432 US grants and 5,321 published applications in this corpus.
Search patents in H10W- Granted patents
- 4,432
- Published applications
- 5,321
- Assignees
- 997
- Inventors
- 8,232
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 4 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 6 | 0 |
| 1988 | 4 | 0 |
| 1989 | 6 | 0 |
| 1990 | 12 | 0 |
| 1991 | 7 | 0 |
| 1992 | 14 | 0 |
| 1993 | 6 | 0 |
| 1994 | 12 | 0 |
| 1995 | 12 | 0 |
| 1996 | 13 | 0 |
| 1997 | 18 | 0 |
| 1998 | 39 | 0 |
| 1999 | 48 | 0 |
| 2000 | 55 | 0 |
| 2001 | 70 | 42 |
| 2002 | 82 | 140 |
| 2003 | 97 | 106 |
| 2004 | 111 | 117 |
| 2005 | 108 | 187 |
| 2006 | 106 | 152 |
| 2007 | 100 | 173 |
| 2008 | 94 | 196 |
| 2009 | 106 | 200 |
| 2010 | 168 | 205 |
| 2011 | 164 | 205 |
| 2012 | 149 | 218 |
| 2013 | 179 | 200 |
| 2014 | 178 | 237 |
| 2015 | 198 | 277 |
| 2016 | 219 | 284 |
| 2017 | 251 | 255 |
| 2018 | 228 | 257 |
| 2019 | 234 | 270 |
| 2020 | 266 | 323 |
| 2021 | 204 | 278 |
| 2022 | 215 | 253 |
| 2023 | 214 | 213 |
| 2024 | 190 | 214 |
| 2025 | 143 | 203 |
| 2026 | 87 | 116 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 72/01331Using blanket deposition1,780
- H10W 72/01321Using local deposition808
- H10W 72/01308Using permanent auxiliary members582
- H10W 72/01351Changing the shapes of die-attach connectors550
- H10W 72/01365Thermally treating389
- H10W 72/01304Using temporary auxiliary members305
- H10W 72/01371Cleaning208
- H10W 72/01361Chemical or physical modification157
All 9 subgroupsShow fewer
Recent patents
- Dicing die attach film and method of producing the same, and semiconductor package and method of producing the same29 Sep 2026US 12,751,310 B2Furukawa Electric Co., Ltd.
- Method for manufacturing a 2.5D/3D electronic packaging structure by embedding a wafer into a cavity of a glass substrate15 Sep 2026US 12,740,444 B2SJ Semiconductor(Jiangyin) Corporation
- Laser transfer of microelectronic device and associated conductive pad15 Sep 2026US 12,740,464 B2Coherent LaserSystems GmbH & Co. KG
- Cleaning liquid and method for manufacturing semiconductor device8 Sep 2026US 12,729,348 B2Kabushiki Kaisha Toshiba
- Redistribution layer metallic layout structure and method with warpage reduction8 Sep 2026US 12,733,435 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Heat dissipation in semiconductor devices8 Oct 2026US 2026/0314410 A1Taiwan Semiconductor Manufacturing Company.Ltd
- 2.5D/3D electronic packaging structure and method for manufacturing same8 Oct 2026US 2026/0314445 A1SJ Semiconductor(Jiangyin) Corporation
- Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach1 Oct 2026US 2026/0305028 A1STATS ChipPAC Pte. Ltd.
Most cited
By later US patents
- Semiconductor chip assemblies with fan-in leads734US 5,148,265 AIST Associates, Inc. · 1992
- Semiconductor chip assemblies having interposer and flexible lead719US 5,148,266 AIST Associates, Inc. · 1992
- Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices620US 8,877,554 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Semiconductor chip assemblies, methods of making same and components for same424US 5,679,977 ATessera, Inc. · 1997
- Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby412US 6,423,570 B1Intel Corporation · 2002