H10W 72/01365
Thermally treating
Official title: {Thermally treating (reflowing H10W72/01357)}
H10W72/01365 (Thermally treating) appears on 389 US grants and 497 published applications in this corpus.
Search patents in H10W- Granted patents
- 389
- Published applications
- 497
- Assignees
- 200
- Inventors
- 1,047
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 3 |
| 2003 | 2 | 2 |
| 2004 | 0 | 2 |
| 2005 | 4 | 5 |
| 2006 | 5 | 1 |
| 2007 | 0 | 4 |
| 2008 | 2 | 7 |
| 2009 | 1 | 6 |
| 2010 | 8 | 6 |
| 2011 | 5 | 5 |
| 2012 | 7 | 18 |
| 2013 | 3 | 16 |
| 2014 | 7 | 24 |
| 2015 | 21 | 34 |
| 2016 | 30 | 49 |
| 2017 | 40 | 48 |
| 2018 | 31 | 34 |
| 2019 | 32 | 31 |
| 2020 | 37 | 40 |
| 2021 | 25 | 29 |
| 2022 | 33 | 38 |
| 2023 | 24 | 17 |
| 2024 | 30 | 28 |
| 2025 | 17 | 22 |
| 2026 | 13 | 28 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Laser transfer of microelectronic device and associated conductive pad15 Sep 2026US 12,740,464 B2Coherent LaserSystems GmbH & Co. KG
- Manufacturing method for semiconductor device8 Sep 2026US 12,733,528 B2Fuji Electric Co., Ltd.
- Energy augmentation structures for use with energy emitters and collectors11 Aug 2026US 12,702,861 B2Immunolight, LLC
- Method of marking semiconductor package4 Aug 2026US 12,702,018 B2Samsung Electronics Co., Ltd.
- Semiconductor device that uses bonding layer to join semiconductor substrates together23 Jun 2026US 12,667,000 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Die attachment film, dicing die bonding film, and semiconductor device manufacturing method1 Oct 2026US 2026/0305443 A1Resonac Corporation
- Integrated circuits with fusion-bonded diamond substrates for thermal management24 Sep 2026US 2026/0293674 A1Intel Corporation
- Sintering film frames and related methods24 Sep 2026US 2026/0293736 A1Semiconductor Components Industries, LLC
- Heat Dissipation Substrate for a Power Semiconductor Module, Manufacturing Method thereof, and Convertor including the same13 Aug 2026US 2026/0239967 A1Lx Semicon Co., Ltd.
- Heat Dissipation Substrate for Power Semiconductor, Power Semiconductor Module including the same, Power Convertor including the same, and Manufacturing method thereof13 Aug 2026US 2026/0239968 A1Lx Semicon Co., Ltd.
Most cited
By later US patents
- Method and structure for wafer to wafer bonding in semiconductor packaging237US 8,377,798 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Three dimensional device integration method and integrated device220US 7,126,212 B2Ziptronix, Inc. · 2006
- Method for low temperature bonding and bonded structure200US 9,331,149 B2Ziptronix, Inc. · 2016
- Three dimensional device integration method and integrated device194US 9,431,368 B2Ziptronix, Inc. · 2016
- Method for low temperature bonding and bonded structure175US 6,902,987 B1Ziptronix, Inc. · 2005