Method of marking semiconductor package

A method of marking a semiconductor package including a semiconductor chip and a package molding layer surrounding the semiconductor chip, the method comprising:

• aligning a dry sheet above a top surface of the package molding layer, the dry sheet including a dry film, a first adhesive material attached to a first surface of the dry film and to a carrier substrate, and a second adhesive material attached to a second surface of the dry film opposite to the first surface of the dry film and facing the package molding layer;
• attaching the second adhesive material to the top surface of the package molding layer;
• liquefying a portion of the dry film and a portion of the second adhesive material by radiating laser light to the carrier substrate, the portion of the second adhesive material being between the portion of the dry film and the top surface of the package molding layer;
• forming an ink marking pattern by solidifying an ink spot corresponding to the liquefied portion of the dry film;
• forming an adhesive layer by solidifying the liquefied portion of the second adhesive material;
• and
• removing a remaining portion of the dry film and a remaining portion of the second adhesive material from the top surface of the package molding layer, the remaining portion of each of the dry film and the second adhesive material having not been liquefied,
• wherein the ink marking pattern includes at least one of information about storage capacity or information for identifying a producer of a product.

A method of marking a semiconductor package including a semiconductor chip and a package molding layer surrounding the semiconductor chip, the method comprising:

• aligning a dry sheet above a top surface of the package molding layer, the dry sheet including a dry film and an adhesive material attaching the dry film to a carrier substrate;
• attaching the dry film to the top surface of the package molding layer;
• forming a hole in the dry film by radiating laser light to the carrier substrate such that a target region of the dry film is liquified, the hole having a tapered shape having a width increasing toward the package molding layer;
• forming an ink marking pattern, including ink spots having a hemispherical shape, by solidifying the liquefied portion of the dry film;
• and
• removing a remaining portion of the dry film from the top surface of the package molding layer, the remaining portion of the dry film having not been liquefied,
• wherein a bottom of the hole has a first width and the ink marking pattern has a diameter that is less than the first width, and
• the ink marking pattern includes at least one of information about storage capacity or information for identifying a producer of a product.