H10W 72/01304
Using temporary auxiliary members
Official title: {using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}
H10W72/01304 (Using temporary auxiliary members) appears on 305 US grants and 413 published applications in this corpus.
Search patents in H10W- Granted patents
- 305
- Published applications
- 413
- Assignees
- 136
- Inventors
- 714
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 2 |
| 2003 | 1 | 1 |
| 2004 | 1 | 2 |
| 2005 | 0 | 4 |
| 2006 | 2 | 1 |
| 2007 | 2 | 0 |
| 2008 | 1 | 2 |
| 2009 | 2 | 4 |
| 2010 | 3 | 2 |
| 2011 | 1 | 9 |
| 2012 | 4 | 19 |
| 2013 | 7 | 20 |
| 2014 | 4 | 24 |
| 2015 | 20 | 36 |
| 2016 | 24 | 42 |
| 2017 | 31 | 31 |
| 2018 | 27 | 31 |
| 2019 | 33 | 37 |
| 2020 | 29 | 37 |
| 2021 | 25 | 33 |
| 2022 | 22 | 30 |
| 2023 | 25 | 13 |
| 2024 | 19 | 13 |
| 2025 | 15 | 7 |
| 2026 | 6 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Method for removing edge of substrate in semiconductor structure17 Mar 2026US 12,581,923 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Redistribution layer metallic layout structure and method with warpage reduction1 Oct 2026US 2026/0305234 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Memory-only cubes and methods of forming the same1 Oct 2026US 2026/0305497 A1Micron Technology, Inc.
- Sintering film frames and related methods24 Sep 2026US 2026/0293736 A1Semiconductor Components Industries, LLC
- Bonding film, semiconductor module, inverter, electronic device, and method for manufacturing semiconductor module30 Jul 2026US 2026/0223716 A1Furukawa Electric Co., Ltd.
Most cited
By later US patents
- Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect32US 9,893,045 B2STATS ChipPAC Pte. Ltd. · 2018
- Pop devices and methods of forming the same28US 9,793,246 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer27US 9,142,532 B2Bondtech Co., Ltd. · 2015
- Integrated fan-out package and method of fabricating the same25US 9,837,359 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Apparatus for aligning and soldering multiple electrode pedestals to the solderable ohmic contacts of semiconductor components22US 4,194,668 ABBC Brown, Boveri & Company, Limited · 1980