Apparatus for aligning and soldering multiple electrode pedestals to the solderable ohmic contacts of semiconductor components
AssigneeBBC Brown, Boveri & Company, Limited
InventorAltan Akyurek
Life of this patent
Estimating the term…
Abstract
An apparatus for aligning and soldering electrode pedestals to the solderable ohmic contacts of individual semiconductor components formed by an undivided silicon wafer. The apparatus includes a soldering assembly for receiving the undivided silicon wafer and for temporarily retaining the electrode pedestals in alignment on the silicon wafer during the soldering of the pedestals to the ohmic contacts; a pedestal mask which is placed over the undivided silicon wafer and which aligns individual pedestals over the ohmic contacts of the silicon wafer; and a shaker apparatus coupled to said soldering base plate for distributing the electrode pedestals to each of the ohmic contacts.
Claims9
An apparatus for aligning and soldering pedestals to the solderable ohmic contacts of individual semiconductor components formed by an individual silicon wafer, comprising:
- an electromagnetically driven shaker table having a gently sloped pedestal feed surface having pedestal sorting chutes and a pedestal selector comb, said comb adapted to be disposed adjacent said wafer so that pedestals located on said feed surface can be distributed to said ohmic contacts of said wafer;
- mask means for aligning said pedestals over said ohmic contacts;
- means for maintaining said mask means in a fixed position respective to said silicon wafer adjacent said comb;
- a removable mounting and soldering base plate removably mounted on said shaker table and adapted to support on said shaker table said wafer with said mask means placed over said wafer for distribution of the pedestals onto the ohmic contacts;
- and
- soldering assembly means for receiving said base plate with said undivided wafer having said pedestals distributed thereon, said soldering assembly means comprising a removable upper retention part adapted to be coupled to said base plate after distribution of said pedestals with said wafer retained between said base plate and said retention part, and a removable top part supported on said retention part, and means for coupling said base plate, said retention part, and said top part for retaining said pedestals in alignment on said silicon wafer during removal of said base plate from said shaker table and during soldering of said pedestals to said ohmic contacts.
An apparatus for aligning and soldering pedestals to the solderable ohmic contacts of individual semiconductor components formed by an undivided silicon wafer, said device comprising:
- shaker means for distributing said pedestals in alignment over said ohmic contacts on said wafer, said shaker means comprising a shaker table, means for removably mounting a graphite mounting and soldering base plate on said shaker table during aligning of said pedestals on said wafer, said base plate adapted to have said wafer mounted thereon, a removable latticed mask adapted to be temporarily mounted over said wafer on said base plate for alignment of said pedestals on said wafer, said shaker table including a feeding plate adjoining said mask and equipped with sorting grooves for directing said pedestals to respective components, wherein during alignment of said pedestals over said ohmic contacts of said components, said table with said base plate, said wafer, and said mask respectively mounted thereon may be shaked such that a pedestal is distributed to each ohmic contact through said mask, said mask thereafter removed from said base plate;
- and,
- soldering assembly means for receiving said undivided silicon wafer and for temporarily retaining said pedestals in alignment on said silicon wafer during soldering of said pedestals to said ohmic contacts, said soldering means comprising said base plate removed from said shaker table, a removable upper retention part for maintaining said pedestals in alignment and adapted to be maintained on said wafer with the pedestals aligned thereon, a removable top plate mounted on said upper retention part for maintaining said upper retention part and said pedestals in place, and soldering assembly alignment pins maintaining said base plate, said upper retention part, and said top plate in alignment during soldering of said pedestals to said ohmic contacts, said base plate acting as a template and adapted to maintain said wafer in place during the soldering of said pedestals.
Dependencies are inferred from the claim text.