Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

A method of making a semiconductor device, comprising:

• providing an interposer substrate including,
• a core substrate,
• a plurality of conductive vias formed through the core substrate, and
• a plurality of conductive pillars extending from the interposer substrate and electrically connected to the conductive vias;
• disposing the interposer substrate over a first semiconductor die;
• and
• depositing an encapsulant over the first semiconductor die, wherein the encapsulant is injected into or exhausted from an opening in the interposer substrate.

A method of making a semiconductor device, comprising:

• providing an interposer substrate including,
• a core substrate,
• a conductive via in the core substrate,
• a conductive layer formed over the core substrate, and
• a conductive pillar extending from the conductive layer;
• disposing the interposer substrate over a first semiconductor die;
• and
• depositing an encapsulant over the first semiconductor die, wherein the encapsulant is injected into or exhausted from an opening in the interposer substrate.