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US 12,655,323 B2Granted
Adhesive transfer film and method for manufacturing power module substrate by using same
AssigneeAmosense Co., Ltd.
InventorsYounghwan Jun, Kyungwhan Woo, Yongsul Song
Life of this patent
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Abstract
The present disclosure relates to an adhesive transfer film for bonding a semiconductor chip and a spacer to a substrate and a method for manufacturing a power module substrate by using same, the adhesive transfer film being obtained by manufacturing an Ag sintering paste in the form of a film. The present disclosure can reduce the process time by minimizing a sintering process, and can reduce equipment investment cost.
Claims17
An adhesive transfer film comprising:
- a base film;
- a sticky layer on the base film;
- and
- an adhesive layer on the sticky layer,
- wherein the adhesive layer is formed in a multilayer structure on the sticky layer,
- wherein the adhesive layer includes:
- a first adhesive layer laminated on an upper surface of the sticky layer;
- a second adhesive layer laminated on an upper surface of the first adhesive layer;
- and
- a third adhesive layer laminated on an upper surface of the second adhesive layer,
- the first to third adhesive layers include Ag powders made of flake form nanoparticles, and
- an average particle diameter of the Ag powder included in the second adhesive layer is relatively smaller than average particle diameters of the Ag powders included in the first adhesive layer and the third adhesive layer.
9 more elements
A method for manufacturing a power module substrate, the method comprising:
- a preparing step of preparing an adhesive transfer film;
- a temporary bonding step of transferring an adhesive layer on the adhesive transfer film to a component to be mounted on the power module substrate, and temporarily bonding the component to which the adhesive layer is transferred to a lower substrate by medium of the adhesive layer;
- and
- a main bonding step of bonding an upper substrate to an upper portion of the component temporarily bonded on the lower substrate and sintering to main bond the component between the lower substrate and the upper substrate.
1 more element
Dependencies are inferred from the claim text.