H10W 72/01308
Using permanent auxiliary members
Official title: {using permanent auxiliary members, e.g. using alignment marks}
H10W72/01308 (Using permanent auxiliary members) appears on 582 US grants and 595 published applications in this corpus.
Search patents in H10W- Granted patents
- 582
- Published applications
- 595
- Assignees
- 228
- Inventors
- 1,299
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 5 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 4 | 0 |
| 1996 | 4 | 0 |
| 1997 | 6 | 0 |
| 1998 | 11 | 0 |
| 1999 | 11 | 0 |
| 2000 | 17 | 0 |
| 2001 | 18 | 7 |
| 2002 | 23 | 31 |
| 2003 | 19 | 20 |
| 2004 | 28 | 22 |
| 2005 | 13 | 37 |
| 2006 | 19 | 31 |
| 2007 | 28 | 35 |
| 2008 | 21 | 46 |
| 2009 | 19 | 45 |
| 2010 | 37 | 35 |
| 2011 | 35 | 42 |
| 2012 | 26 | 36 |
| 2013 | 34 | 23 |
| 2014 | 28 | 35 |
| 2015 | 28 | 27 |
| 2016 | 28 | 17 |
| 2017 | 18 | 19 |
| 2018 | 23 | 18 |
| 2019 | 11 | 12 |
| 2020 | 11 | 7 |
| 2021 | 11 | 10 |
| 2022 | 5 | 8 |
| 2023 | 5 | 8 |
| 2024 | 7 | 10 |
| 2025 | 10 | 10 |
| 2026 | 3 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package with solder mask1 Sep 2026US 12,727,487 B2NXP USA, Inc.
- Packaging systems and methods for semiconductor devices18 Aug 2026US 12,713,958 B2Avago Technologies International Sales Pte. Limited
- Dam for three-dimensional integrated circuit3 Mar 2026US 12,568,849 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device with sealing resin over chip and lead frame11 Nov 2025US 12,469,771 B2Fuji Electric Co., Ltd.
- Integrated circuit package and method of forming same11 Nov 2025US 12,469,814 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit (ic) package having a package mold layer between a die and a substrate comprising two types of resin to improve coupling of die interconnects having different sizes25 Jun 2026US 2026/0182394 A1QUALCOMM Incorporated
- Solder mask defined underfill material application control4 Jun 2026US 2026/0157226 A1BAE Systems Information and Electronic Systems Integration Inc.
- Semiconductor package and method for forming the same30 Apr 2026US 2026/0123381 A1STATS ChipPAC Management Pte. Ltd.
- Integration of self-assembly features with photonic circuits19 Mar 2026US 2026/0082917 A1Intel Corporation
- Semiconductor package and method of manufacturing the same11 Dec 2025US 2025/0379172 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Method of producing lead frame having uneven surfaces270US 6,197,615 B1Samsung Electronics Co., Ltd. · 2001
- Reduced stress plastic package256US 5,278,446 AMotorola, Inc. · 1994
- Self-centering electrode for power devices249US 4,935,803 AMotorola, Inc. · 1990
- Symmetrical package for semiconductor die208US 6,256,200 B12001
- Ball grid array integrated circuit package with thermal conductor198US 5,583,378 AAmkor Electronics, Inc. · 1996