Integrated circuit package and method of forming same

A package comprising:

• a package substrate, the package substrate having a first side and a second side opposite to the first side;
• a package component bonded to the first side of the package substrate, the package component comprising:
• an interposer bonded to the first side of the package substrate;
• a first integrated circuit die and a second integrated circuit die bonded to the interposer;
• and
• a die-to-die underfill region between the first integrated circuit die and the second integrated circuit die;
• a front-side warpage control structure attached to the first side of the package substrate using a first adhesive, the front-side warpage control structure comprising a first disconnected structure and a second disconnected structure laterally separated from each other by a first gap and a second gap, the package component being interposed between the first gap and the second gap, the first gap being aligned with a first end of the die-to-die underfill region, the second gap being aligned with a second end of the die-to-die underfill region;
• and
• a backside warpage control structure attached to the package substrate using a second adhesive, the backside warpage control structure being embedded in the package substrate from the second side of the package substrate, the backside warpage control structure comprising a third disconnected structure and a fourth disconnected structure laterally separated from each other, the first end of the die-to-die underfill region being disposed within a perimeter of the third disconnected structure in a plan view, the second end of the die-to-die underfill region being disposed within a perimeter of the fourth disconnected structure in the plan view.

A package comprising:

• a package substrate, the package substrate having a first side and a second side opposite to the first side;
• a package component bonded to the first side of the package substrate, the package component comprising an interposer, a first integrated circuit die attached to the interposer, a second integrated circuit die attached to the interposer, and a die-to-die underfill region between the first integrated circuit die and the second integrated circuit die, wherein the interposer is attached to the first side of the package substrate;
• and
• a backside warpage control structure attached to the second side of the package substrate, the backside warpage control structure comprising a first disconnected structure, the first disconnected structure overlapping the die-to-die underfill region in a plan view.