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US 6,197,615 B1Granted
Method of producing lead frame having uneven surfaces
AssigneeSamsung Electronics Co., Ltd.
InventorsGun Ho Song, Si Chan Sung
Life of this patent
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Abstract
A lead frame for manufacturing semiconductor device packages has inner leads, tie bars and a die pad that are formed with irregular dimples on their respective upper and lower surfaces. This improves the bonding strength between the lead frame and the molding compound as well as between the die pad and a semiconductor device. The dimples are formed during the manufacture of the lead frame which allows the lead frame to be economically and easily manufactured.
Claims9
A method for producing a lead frame for semiconductor device packages, comprising:
- providing particles for mechanically impacting one or more surfaces of a lead frame material to produce a modified material having an uneven surface;
- controlling formation of said dimples within desired ranges of at least one of size number and shape by adjusting at least one of a size of said particles, a concentration of said particles a speed of said lead frame material through said providing, and a pressure of said providing, while within these desired ranges, the dimples are randomly and irregularly formed;
- leveling said modified material to produce a leveled modified material;
- and
- stamping said leveled modified material to produce said lead frame.
2 more elements
Dependencies are inferred from the claim text.