Semiconductor device with sealing resin over chip and lead frame

A semiconductor device comprising:

• a lead frame having an upper surface provided with a concave portion and a lower surface provided with a convex portion;
• a semiconductor chip fixed to the upper surface of the lead frame;
• a solder layer provided in the concave portion and fixing the semiconductor chip to the upper surface of the lead frame;
• and
• a sealing resin for sealing the semiconductor chip and the lead frame, wherein
• a thickness of the solder layer is larger than a depth of the concave portion,
• the sealing resin covers at least a part of the lower surface of the lead frame,
• at least a part of the convex portion of the lead frame is exposed from the sealing resin,
• the solder layer contacts a side of the concave portion and does not contact a side of the semiconductor chip, and
• a fillet of the solder layer extends from a bottom surface of the semiconductor chip to a side of a recess.