Semiconductor package and method for forming the same
AssigneeSTATS ChipPAC Management Pte. Ltd.
InventorsChangOh KIIM, JinHee JUNG, YoungJoo CHOI, HeeSoo LEE
Life of this patent
Estimating the term…
Abstract
A semiconductor package and a method for forming the same are provided. The method includes: providing a substrate; mounting a semiconductor die on a top surface of the substrate; forming a barrier wall on a peripheral area of a top surface of the semiconductor die; dispensing a first fluid material on the top surface of the semiconductor die, wherein the barrier wall prevents the first fluid material from flowing across it; and curing the first fluid material to form a back side metallization (BSM) layer.
Claims19
A method for forming a semiconductor package, comprising:
- providing a substrate;
- mounting a semiconductor die on a top surface of the substrate;
- forming a barrier wall on a peripheral area of a top surface of the semiconductor die;
- dispensing a first fluid material on the top surface of the semiconductor die, wherein the barrier wall prevents the first fluid material from flowing across it;
- and
- curing the first fluid material to form a back side metallization (BSM) layer.
A semiconductor package, comprising:
- a substrate;
- a semiconductor die mounted on a top surface of the substrate;
- a barrier wall formed on a peripheral area of a top surface of the semiconductor die;
- and
- a back side metallization (BSM) layer formed on the top surface of the semiconductor die, wherein the BSM layer is enclosed or partially enclosed with the barrier wall.
Dependencies are inferred from the claim text.