Integration of self-assembly features with photonic circuits

An apparatus, comprising:

• a first optical coupling layer over a surface of a substrate, the first optical coupling layer within a region of the surface of the substrate;
• a second optical coupling layer over a surface of a photonics integrated circuit (PIC) die, the second optical coupling layer within a region of the surface of the PIC die, wherein the first optical coupling layer is coupled to the second optical coupling layer;
• and
• one or more structures extending substantially around an outer perimeter of the first and second optical coupling layers wherein the one or more structures comprise a layer of material having an atomic composition of at least ten percent carbon or at least ten percent fluorine.

A method, comprising:

• depositing a liquid droplet on one of a first optical coupling layer of a substrate, the first optical coupling layer surrounded by first hydrophobic structures, or a second optical coupling layer of a photonics integrated circuit (PIC) die, the second optical coupling layer surrounded by second hydrophobic structures;
• contacting the other of the first optical coupling layer and the second optical coupling layer to the liquid droplet;
• and
• evaporating the liquid droplet to bond the first optical coupling layer and the second optical coupling layer.