H10W 72/01315
Forming coatings
Official title: {Forming coatings}
H10W72/01315 (Forming coatings) appears on 111 US grants and 139 published applications in this corpus.
Search patents in H10W- Granted patents
- 111
- Published applications
- 139
- Assignees
- 76
- Inventors
- 309
- Latest grant
- 29 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 3 |
| 2011 | 0 | 2 |
| 2012 | 3 | 2 |
| 2013 | 4 | 4 |
| 2014 | 3 | 8 |
| 2015 | 7 | 8 |
| 2016 | 7 | 14 |
| 2017 | 9 | 18 |
| 2018 | 10 | 10 |
| 2019 | 8 | 9 |
| 2020 | 16 | 18 |
| 2021 | 13 | 16 |
| 2022 | 12 | 10 |
| 2023 | 6 | 7 |
| 2024 | 4 | 3 |
| 2025 | 5 | 3 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding film, tape for wafer processing, method for producing bonded body, and bonded body and pasted body29 Jul 2025US 12,374,646 B2Furukawa Electric Co., Ltd.
- Anisotropic conductive film with carbon-based conductive regions having void space and related semiconductor device assemblies and methods15 Jul 2025US 12,362,311 B2Micron Technology, Inc.
- Semiconductor device24 Jun 2025US 12,341,105 B2Shinko Electric Industries Co., Ltd.
- Joining material, production method for joining material, and joined body25 Mar 2025US 12,257,622 B2Senju Metal Industry Co., Ltd.
- Display device and method of manufacturing the same4 Mar 2025US 12,243,844 B2Samsung Display Co., Ltd.
- Method for manufacturing semiconductor device and semiconductor device19 Mar 2026US 2026/0082978 A1Mitsubishi Electric Corporation
- Package structure and method of forming thereof12 Feb 2026US 2026/0047447 A1Chingis Technology Corporation
- Package structure and packaging method18 Dec 2025US 2025/0385211 A1Sureway Technology Co.,Ltd.
- Chip bonding apparatus for semiconductor packaging and semiconductor packaging method using the same3 Jul 2025US 2025/0219012 A1Silicon Box Pte. Ltd.
- Open web electrical support for contact pad and method of manufacture1 May 2025US 2025/0140670 A1
Most cited
By later US patents
- Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices620US 8,877,554 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Nitride-enriched oxide-to-oxide 3D wafer bonding258US 9,496,239 B1International Business Machines Corporation · 2016
- Method and structure for wafer to wafer bonding in semiconductor packaging237US 8,377,798 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer27US 9,142,532 B2Bondtech Co., Ltd. · 2015
- Semiconductor package and manufacturing method thereof8US 9,633,939 B2Amkor Technology, Inc. · 2017