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US 9,633,939 B2Granted
Semiconductor package and manufacturing method thereof
AssigneeAmkor Technology, Inc.
InventorsDo Hyung Kim, Dae Joon Park, See Won Kim, Jung Soo Park
Life of this patent
Estimating the term…
Abstract
A semiconductor package and a method of manufacturing a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor packages, and methods of making thereof, that comprise a cover layer that enhances reliability of the semiconductor packages.
Claims20
A semiconductor package comprising:
- a redistribution (RD) structure comprising an upper RD side, a lower RD side, and a lateral RD side that extends between the upper RD side and the lower RD side;
- a conductive pad on the upper RD side;
- a conductive post on the upper RD side, the conductive post comprising an upper post end, a lower post end, and a lateral post side that extends between the upper post end and the lower post end;
- a semiconductor die on the upper RD side and electrically connected to the conductive pad;
- a cover layer covering at least a portion of the semiconductor die and at least a portion of the conductive post;
- and
- an encapsulating material that covers at least a portion of the cover layer, at least a portion of the semiconductor die, and at least a portion of the conductive post.
4 more elements
A semiconductor package comprising:
- a redistribution (RD) structure comprising an upper RD side, a lower RD side, and a lateral RD side that extends between the upper RD side and the lower RD side;
- a conductive pad on the upper RD side;
- a conductive post on the upper RD side, the conductive post comprising an upper post end, a lower post end, and a lateral post side that extends between the upper post end and the lower post end;
- a semiconductor die on the upper RD side and electrically connected to the conductive pad;
- a cover layer covering at least a portion of the conductive post and at least a portion of the RD structure;
- and
- an encapsulating material that covers at least a portion of the cover layer, at least a portion of the semiconductor die, and at least a portion of the conductive post.
4 more elements
A semiconductor package comprising:
- a redistribution (RD) structure comprising an upper RD side, a lower RD side, and a lateral RD side that extends between the upper RD side and the lower RD side;
- a conductive pad on the upper RD side;
- a conductive post on the upper RD side, the conductive post comprising an upper post end, a lower post end, and a lateral post side that extends between the upper post end and the lower post end;
- a semiconductor die on the upper RD side and electrically connected to the conductive pad;
- a cover layer covering at least a portion of the semiconductor die and at least a portion of the RD structure;
- and
- an encapsulating material that covers at least a portion of the cover layer, at least a portion of the semiconductor die, and at least a portion of the conductive post.
4 more elements
Dependencies are inferred from the claim text.